Final Test无法完全刷掉的问题
测试不是万能的,但没有测试是万万不能的。根据经验总结,Final Test无法完全刷掉的问题如下:
Back Metal Peeling
Collet Mark
Die Surface Scratches
Die Crack/Chipping/kerf shift (划偏)
Die Shift
Edge die
Epoxy/Solder Over flow (Epoxy on die), Bridge, Void, etc.
Ball Lift/shift etc.
Ball Neck Broken
Wedge Bond Broken/Lift
Sagging Wire / PowerDi Package Clip Bending
Wire Bonding Cratering
Additional wire
LDF Distortion, Residue, Pad Bridging, etc.
电性极为相近的Mix Die
Some wafer top side defects: e.g. Top Metal Bridging, Misalignment, etc.
Probe mark shift/Incomplete trim fuse
后续待补充中……
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